Alumina (Al₂O₃)
Ceramic Wafer Carrier & Boat
Alumina and silicon carbide wafer carriers, boats, and cassettes for high-temperature semiconductor processes, reviewed by material, geometry, and application requirements.
Custom dimensions and specifications available upon request.
Technical Specifications
| Parameter | Value |
|---|---|
| Materials Available | Al₂O₃ 99.5% / Al₂O₃ 99.9% / SiC (reaction-bonded) |
| Max Use Temperature | Application-dependent by ceramic grade |
| Slot Pitch Tolerance | Specified per drawing |
| Slot Width Tolerance | Specified per drawing |
| Flatness (Carrier Plate) | Reviewed by carrier design |
| Thermal Shock Resistance | Reviewed by thermal cycle |
Ceramic Wafer Carrier & Boat
Ceramic Wafer Carriers & Boats
Ceramic wafer carriers provide an alternative to quartz boats in applications requiring:
- Higher-temperature applications where quartz may not be suitable after application review
- Superior wear resistance — alumina and SiC resist abrasion from wafer handling
- Thermal shock resistance — silicon carbide carriers can be reviewed for rapid thermal cycling
- Chemical compatibility — reviewed when quartz is not suitable for the process environment
Material Selection Guide
| Requirement | Al₂O₃ 99.5% | Al₂O₃ 99.9% | RB-SiC |
|---|---|---|---|
| Temperature exposure | Reviewed by application | Reviewed by application | Reviewed by application |
| Thermal shock | Project-specific | Project-specific | Project-specific |
| Wear resistance | Suitable for many handling parts | Suitable for many handling parts | Suitable for higher-wear applications |
| Contamination concern | Review material certificate and process environment | Review material certificate and process environment | Review material certificate and process environment |
| Thermal conductivity | Grade-dependent | Grade-dependent | Grade-dependent |
| Best process | Diffusion, oxidation review | High-purity process review | RTP and rapid-cycling review |
Product Types
Horizontal Alumina Boat
Replacement ceramic carriers can be reviewed from drawings or samples for furnace systems where quartz may not meet temperature, wear, or chemistry requirements.
| Wafer Size | Slots | Slot Pitch | Overall Size | Material |
|---|---|---|---|---|
| 4” | 25 | 4.76 mm | 130 × 130 mm | Al₂O₃ 99.5% |
| 6” | 25 | 6.35 mm | 175 × 180 mm | Al₂O₃ 99.5% |
| 8” | 25 | 7.62 mm | 215 × 230 mm | Al₂O₃ 99.5% or 99.9% |
| 12” | 25 | 9.52 mm | 265 × 335 mm | Al₂O₃ 99.9% |
SiC Susceptor / Carrier Plate
Flat SiC plates can be reviewed for single-wafer or small-batch RTP systems where thermal conductivity, geometry, and mounting requirements are specified.
| Parameter | Value |
|---|---|
| Flatness | Specified per drawing |
| Surface roughness (wafer contact side) | Specified by wafer contact requirement |
| Dimensional tolerance | Specified per drawing |
| Max temperature | Reviewed by ceramic grade and atmosphere |
| Thermal uniformity | Reviewed by design and test criteria |
Machining Precision
Ceramic carrier machining requirements are reviewed by grade, geometry, and inspection scope:
| Feature | Alumina Tolerance | SiC Tolerance |
|---|---|---|
| Slot width | Per drawing | Per drawing |
| Slot pitch | Per drawing | Per drawing |
| Overall dimensions | Per drawing | Per drawing |
| Surface roughness | Per application | Per application |
| Flatness (carrier base) | Per drawing | Per drawing |
Related Products
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Quartz Diffusion Tube
Fused quartz diffusion and oxidation tubes for semiconductor furnaces — straight bore, flanged, and bell-end configurations reviewed against furnace and process requirements.
Custom Precision Components
Custom precision components in fused quartz, sapphire, and technical ceramics manufactured from drawings or samples for semiconductor, optics, laboratory, and industrial applications.
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