Technical Resources & FAQ

For diffusion and oxidation processes above 1100°C, we typically recommend natural fused quartz for standard duty, or synthetic fused silica for ultra-critical processes that require extremely low metallic impurities.

Natural fused quartz is melted from crystalline quartz and usually carries more trace impurities. Synthetic fused silica is produced from high-purity chemical precursors, offering lower impurity levels and better consistency for demanding semiconductor use.

Our standard CNC grinding tolerance is typically plus or minus 0.05 mm for most features, with tighter tolerances down to plus or minus 0.01 mm available for critical dimensions. Optical polishing and low-roughness finishing are also available depending on geometry.

Yes. We can provide raw material certificates, inspection records, and traceability documentation based on project requirements and customer quality standards.

Yes. Drawing-based custom fabrication is a core part of the business. We support common engineering formats such as DXF, DWG, STEP, IGES, and PDF, and can also review physical samples for reverse engineering.

Lead time depends on material, geometry, and inspection scope. Standard items are usually faster, while custom machined parts often require more time for programming, machining, cleaning, and final inspection.

Yes. We support export shipments for international customers and can prepare the standard commercial and packing documents needed for overseas delivery.

Cleaning level depends on the application. For semiconductor-related projects, components can be processed with controlled cleaning, rinsing, drying, and protective packaging according to the required cleanliness standard.