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Fused Quartz Nozzles & Fluid Injectors for Semiconductor
Our precision-machined custom fused silica (quartz) nozzles and fluid injectors are engineered for demanding semiconductor, ALD/CVD, and chemical processing applications. These high-purity components offer exceptional chemical inertness, thermal stability, and precise fluid delivery, ensuring optimal performance in critical environments.
What to Provide for a Quote
- Drawing (PDF/STEP) or key dimensions (OD / ID / Length)
- Orifice details: diameter, quantity, spacing, position; tip style; any side ports
- Operating environment: vacuum / plasma / chemicals; maximum temperature; target flow behavior
- Critical tolerances and surface finish requirements
Key Specifications
- Material: High-purity fused silica (quartz, SiO₂); material certificate available by request
- Geometry: Straight / stepped / tapered / L-shaped; fully custom per drawing
- Dimensions: Per drawing (made-to-order); uniform wall thickness per design
- Tips & Orifices: Single or multiple orifices, laser-drilled or etched; size and spacing per drawing
- Features: Side perforation arrays, lateral ports, flanges/threads/collars, end caps or hemispherical ends (optional)
- Surface Finish: Fire-polished / ground / polished (OD/ID) as required; deburred edges
- Straightness & Concentricity: Per drawing; geometry-dependent (we can advise feasible tolerances)
- Cleanliness: Ultrasonic cleaning; Class-100 compatible packaging; tip protectors
- Marking: Laser part ID or flow direction by request
Material Properties (Typical)
- High optical transmittance and very low thermal expansion
- Excellent chemical inertness to acids, alkalis, and organic solvents (except HF)
- Stable under high temperature and thermal cycling
- Electrical insulation and low outgassing for clean processes
Applications
ALD/CVD precursor delivery, plasma tools, micro-reactors, analytical instrumentation, precision chemical dosing in vacuum or high-temperature environments
Processing & Design Notes
- Orifices produced via laser drilling/etching; burr-free, chip-free edges
- Stress-relief annealing and acid cleaning available
- Fillets at sharp transitions recommended to reduce stress concentration
- Concentricity/straightness controlled per drawing; practical tolerance advice available
Inspection & Testing
- Dimensional inspection: OD/ID/length; orifice size and spacing
- Optional tests: helium leak test (for vacuum assemblies), flow-rate verification, birefringence/stress check
- 100% visual inspection for chips, cracks, and contamination
Packaging & Storage
- Anti-static, vacuum-sealed packaging with shock-absorbent foam and tip protection. Store in a dry environment (<40% RH) at 10–30 °C.
Notes
Custom configurations (hole patterns, coatings, or additional markings) available upon request.
Compliance certificates (RoHS, ISO 9001) provided with bulk orders.