Fused Quartz Supports & Process Holders

Fused Quartz Supports & Process Holders

Fused quartz supports, frames, and holders engineered for wafer processing, CVD, plasma tools, wet benches, and high-temperature furnaces. Built from high-purity fused silica and assembled by precision flame-fusion, these fixtures deliver excellent thermal stability, chemical inertness, and tight dimensional control—providing clean, stable support and reliable handling in critical environments.

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What to Provide for a Quote

• Drawing (PDF/STEP) or key dimensions: overall size, rail/bar diameter, standoff height, interface points
• Payload & interface: part size/weight to be held (wafer/boat/substrate), number of contact points, target clearances
• Use mode: static support vs. transfer/robot handling; mounting pattern or hook/foot design
• Environment: chemicals, vacuum/pressure, maximum temperature and thermal-cycle profile
• Surface & contact: polished pads vs. ground finish; edge radii/chamfers to prevent scratching
• Critical tolerances: flatness/squareness, parallelism, allowable deflection under load
• Quantity (prototype or batch), inspection reports required, packaging/cleanliness level

Key Specifications

• Material: High-purity fused quartz (SiO₂); material certificate available by request
• Geometry: Frames, racks, cradles, carriers, brackets and cross-braced supports; monolithic or flame-fused assemblies
• Dimensions: Per drawing (made-to-order) with uniform section thickness for thermal stability
• Features: Standoffs/feet, rails, tabs/hooks, alignment keys or dowels, weight-reduction pockets, drain/vent holes
• Construction: Precision machining with smooth, chip-free joints; stress-relief annealing available
• Surface Finish: Fire-polished edges; polished contact pads for scratch-free handling; deburred radii on all contact points
• Cleanliness: Ultrasonic/DI cleaning; Class-100 compatible packaging; optional laser part ID/orientation mark

Material Properties (Typical)

• Very low thermal expansion and good thermal-shock tolerance
• Excellent chemical resistance to most process media (note: HF attacks quartz)
• Electrically insulating, low outgassing; optically clean surfaces for contamination-sensitive tools

Processing & Design Notes

• Keep wall/rod thickness uniform and add generous fillets at joints to minimize stress concentration
• Define contact pad size/finish and allowable gap to the payload to avoid micro-chipping and particle traps
• Use cross-bracing or ribs where stiffness and low deflection are critical; specify target deflection under load
• Vent blind cavities/holes that see vacuum to prevent virtual leaks
• We can advise practical tolerances for flatness, squareness, parallelism, and runout based on size, geometry, and load

Inspection & Testing

• Dimensional verification: overall size, standoff height, rail/rod spacing, hole positions; squareness/parallelism checks
• Visual inspection: 100% check for chips, micro-cracks, inclusions, and contamination
• Optional: birefringence/stress evaluation; load/deflection test; cleanliness report

Applications

Wafer boat and substrate supports, furnace hot-zone frames, wet-bench racks and carriers, transfer fixtures for robotic or manual handling, alignment and spacing fixtures in CVD/etch/clean tools

Packaging & Storage

Protective caps on contact ends, edge guards, and separators; anti-static, vacuum-sealed packaging with rigid outer protection. Store dry (<40% RH) at 10–30 °C and away from HF-containing chemicals.

Quick Inquiry

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