Opaque Fused Quartz (OP) Rings for High-Temperature Process

Opaque Fused Quartz (OP) Rings for High-Temperature Process

OP (opaque) fused quartz rings designed for high-temperature, high-purity applications such as semiconductor furnace sealing, tube-end supports, and hot-zone thermal shields. Manufactured from opacified, high-purity fused silica with uniform micro-bubble structure, these rings provide excellent thermal stability, chemical resistance, and tight dimensional control to ensure reliable performance and contamination-free operation.

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What to Provide for a Quote

• Drawing (PDF/STEP) or key dimensions: outer/inner diameter, thickness, step heights/widths
• Mating parts & interface: furnace tube OD/ID, door plate, clamp surfaces, gasket or groove details
• Features: double-lip/stepped profiles, alignment notches/keys, bolt holes & countersinks, vent holes, chamfers/bevels
• Operating conditions: max temperature, thermal cycling profile, atmosphere/chemicals
• Critical tolerances: flatness, parallelism, concentricity/runout; required surface finish at sealing lands
• Quantity (prototype or batch), inspection reports needed, packaging/cleanliness level

Key Specifications

• Material: Opaque (opacified) high-purity fused quartz (SiO₂); material certificate available by request
• Geometry: Flat rings, stepped/ledged rings, double-lip rings, segmented or monolithic construction—fully custom per drawing
• Functional Surfaces: Ground/polished sealing lands for stable contact; smooth radii to reduce particle generation
• Thermal Function: Micro-bubble structure improves IR scattering and thermal insulation, helping stabilize hot-zone temperature and reduce heat loss
• Assembly: Precision machining with flame-fused joints where required; stress-relief annealing available
• Cleanliness: Ultrasonic/DI cleaning; Class-100 compatible packaging with edge protectors

Material Properties (Typical)

• High thermal stability and low thermal expansion; good thermal-shock tolerance
• Excellent chemical inertness to most process gases/chemicals (note: HF attacks quartz)
• Electrically insulating, low outgassing; uniform opacification for consistent thermal behavior

Processing & Design Notes

• Keep section thickness uniform and use generous internal radii to minimize stress concentration
• Specify vent/counterbores on through-holes exposed to vacuum to avoid virtual leaks
• Define sealing land width/finish and allowable ring-to-tube gap to maintain leak-tightness and alignment
• Define sealing land width/finish and allowable ring-to-tube gap to maintain leak-tightness and alignment
• We can advise feasible tolerances for flatness, parallelism, concentricity, and runout based on size/geometry

Inspection & Testing

• Dimensional verification (OD/ID/thickness; step heights/widths; datum locations)
• Flatness/parallelism and runout checks of sealing lands and reference faces
• Visual inspection for chips, micro-cracks, inclusions; opacification uniformity assessment
• Optional: birefringence/stress evaluation; cleanliness verification report

Applications

Furnace tube end sealing and support, LPCVD/oxidation hot-zone rings, thermal shields/reflectors, door/plate interfaces, diffusion and anneal processes requiring high purity and stable temperature fields

Packaging & Storage

Ring separators and edge guards; anti-static, vacuum-sealed packaging with rigid outer protection. Store dry (<40% RH) at 10–30 °C and away from HF-containing chemicals.

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