Ceramic Cover Plates for Semiconductor & Plasma Etching

Ceramic Cover Plates for Semiconductor & Plasma Etching

Precision ceramic cover plates, crafted from high-purity Alumina (Al2O3), Zirconia (ZrO2), or Silicon Nitride (Si3N4), are engineered for critical semiconductor processing, vacuum, and plasma etching. These custom plates offer superior thermal, electrical, and mechanical properties, meeting strict industry standards for demanding high-temperature applications.

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Made-to-Order Dimensions

• Per drawing (custom sizes and geometries)

Material Properties

• Base Material: Al₂O₃ (Alumina Ceramic) / Optional: ZrO₂, Si₃N₄
• Density: ≥3.90 g/cm³
• Flexural Strength: ≥350 MPa
• Thermal Conductivity: 24-30 W/(m·K)
• Dielectric Strength: ≥15 kV/mm

Tolerance & Surface Quality

• Concentricity: ≤0.05 mm (OD vs. ID)
• Parallelism: ≤0.03 mm (Top/Bottom Surfaces)
• Surface Roughness: Ra ≤0.4 μm

Key Performance Tests

• Dimensional Inspection: Per ISO 286-2
• Leakage Rate Test: ≤1×10⁻⁹ mbar·L/s (Helium Mass Spectrometry)
• Thermal Shock Resistance: ΔT ≥300°C (5 cycles, no cracks)

Applications

• Semiconductor Processing: Vacuum chambers, Plasma etching components
• High-Temperature Environments: ≤1600°C (Material-Dependent)

Packaging & Handling

• Cleanroom Packaging: Class 100 or better
• Anti-Static: ESD-safe containers

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