Fused Quartz Trays, Bases & Wafer Boats for Wafer Processing

Fused Quartz Trays, Bases & Wafer Boats for Wafer Processing

Custom fused quartz trays, bases, and wafer boats engineered for wafer handling in wet benches, etching, CVD/diffusion, cleaning, and high-temperature processes. Made from high-purity fused silica and precision-machined to your drawing, these carriers provide outstanding thermal stability, chemical inertness, smooth contact surfaces, and clean performance in critical environments.

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What to Provide for a Quote

• Drawing (PDF/STEP) or key dimensions (Length × Width × Height, wall thickness)
• Wafer size and capacity (slot/pocket/post layout, pitch, spacing)
• Features required: drainage holes, overflow weirs, ribs, handles, feet/standoffs, lids/covers, identification marks
• Edge and surface finish requirements (chamfer/bevel, ground or polished surfaces)
• Operating environment (chemicals, wet bench/thermal process), maximum temperature, target cleanliness level
• Critical tolerances and flatness/parallelism targets
• Quantity (prototype or batch), inspection reports needed, and packaging level

Key Specifications

• Material: High-purity fused quartz (SiO₂); material certificate available by request
• Geometry: Rectangular/oval/round trays, bases, and wafer boats; integrated slots, pockets, posts, or ribs per drawing
• Dimensions: Per drawing (made-to-order); uniform wall thickness and reinforced sections as required
• Surface Finish: Fire-polished rims; ground or polished inner surfaces to minimize particle generation; deburred edges and smooth fillets
• Slot/Post Features: Custom slot count and pitch, pocket depth, post diameter/height; radiused corners to protect wafers
• Drainage & Flow: Drain holes, grooves, or overflow weirs designed for efficient chemical exchange and drying
• Handling Features: Handholds, alignment notches, feet/standoffs for stable placement; optional laser ID/flow marks
• Construction: Precision machining and flame-fused assemblies; stress-relief annealing available
• Cleanliness: Ultrasonic/DI rinse; Class-100 compatible packaging

Material Properties (Typical)

• High purity and low outgassing for cleanroom use
• Excellent chemical resistance to most acids/alkalis and organic solvents (note: quartz is not resistant to HF)
• Very low thermal expansion, good thermal-shock tolerance, and stability at high temperature
• Electrical insulation and high surface quality

Processing & Design Notes

• Prefer consistent wall thickness and generous internal radii to reduce stress and particle traps
• Bottom ribs or frames can improve stiffness and flatness for large formats
• Surface finish (ground vs. polished) selected based on process cleanliness and handling needs
• We can advise practical tolerances for slot/pitch uniformity, flatness, and parallelism based on size and geometry

Inspection & Testing

• Dimensional inspection: length/width/height; slot/post pitch and height; pocket depth; flatness/parallelism
• Visual inspection: 100% check for chips, cracks, inclusions, and contamination
• Optional: birefringence/stress check; surface finish verification; cleanliness verification report

Applications

Wafer cleaning and etching, wet bench processing, batch loading for CVD/diffusion/anneal, wafer transport and temporary storage, precision chemical processing

Packaging & Storage

Anti-static, vacuum-sealed packaging with shock-absorbent foam and rigid outer protection. Store dry (<40% RH) at 10–30 °C; keep away from HF-containing chemicals during storage.

Quick Inquiry

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Available 24/7 via email or phone to help you with purchasing our quartz glass products, solutions, usage issues, or providing technical support.

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