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Ceramic Plates for Semiconductor Etching
Our precision-machined ceramic plates, available in Alumina (Al2O3), Zirconia (ZrO2), and Silicon Nitride (Si3N4), are custom-engineered for demanding semiconductor, vacuum, and plasma etching processes. These high-performance parts offer exceptional thermal, electrical, and mechanical properties, ensuring reliability in high-temperature environments.
Made-to-Order Dimensions
- Per drawing (custom sizes and geometries)
Material Properties
- Base Material: Al₂O₃ (Alumina Ceramic) / Optional: ZrO₂, Si₃N₄
- Density: ≥3.90 g/cm³
- Flexural Strength: ≥350 MPa
- Thermal Conductivity: 24-30 W/(m·K)
- Dielectric Strength: ≥15 kV/mm
Tolerance & Surface Quality
- Concentricity: ≤0.05 mm (OD vs. ID)
- Parallelism: ≤0.03 mm (Top/Bottom Surfaces)
- Surface Roughness: Ra ≤0.4 μm
Key Performance Tests
- Dimensional Inspection: Per ISO 286-2
- Leakage Rate Test: ≤1×10⁻⁹ mbar·L/s (Helium Mass Spectrometry)
- Thermal Shock Resistance: ΔT ≥300°C (5 cycles, no cracks)
Applications
- Semiconductor Processing: Vacuum chambers, Plasma etching components
- High-Temperature Environments: ≤1600°C (Material-Dependent)
Packaging & Handling
- Cleanroom Packaging: Class 100 or better
- Anti-Static: ESD-safe containers
Compliance Statement
Meets SEMI F47-0706 (Ceramic Components for Semiconductor Equipment)
Disclaimer
Customization available upon request. Critical parameters marked with “□” require explicit confirmation.
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