Fused Quartz Grippers & Wafer Handling Tools

Fused Quartz Grippers & Wafer Handling Tools

Custom fused quartz grippers and end-effectors designed for ultra-clean wafer handling and precise component transfer in semiconductor and cleanroom automation. Machined from high-purity fused silica and finished for low particle generation, these tools provide excellent chemical inertness, thermal stability, and smooth, scratch-free contact with sensitive substrates.

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What to Provide for a Quote

• Drawing (PDF/STEP) or key dimensions: overall size, fork opening/throat width, contact-pad width, thickness
• Wafer size and handling method (manual/robotic), mounting pattern or handle interface
• Edge/finish requirements: chamfer/bevel, polished contact areas, anti-slip texture if needed
• Operating environment: chemicals, temperature, vacuum/cleanroom class; ESD or light-blocking needs if any
• Critical tolerances (flatness, parallelism, symmetry) and allowable deflection
• Quantity (prototype or batch); inspection reports and packaging level

Key Specifications

• Material: High-purity fused quartz (SiO₂); material certificate available by request
• Geometry: Y-fork / U-fork / paddle / scoop / ring-style end-effector; single-piece or assembled with ribs for stiffness
• Dimensions: Per drawing (made-to-order); balanced weight and center of gravity for manual or robotic use
• Contact Areas: Fully polished, particle-minimized surfaces; radiused edges to protect wafer edge and notch
• Features: Alignment notches, relief pockets for backside features, vacuum slots/cut-outs, handle or robot-mount holes, countersinks, laser ID
• Edge & Surface Finish: Fire-polished rims; ground or optical polish on functional faces; optional micro-texture for grip
• Cleanliness: Ultrasonic/DI cleaning; Class-100 compatible packaging

Material Properties (Typical)

• Excellent chemical resistance (note: HF attacks quartz)
• Very low thermal expansion and good thermal-shock tolerance
• Electrically insulating, low outgassing; optically clean surface for contamination-sensitive handling

Processing & Design Notes

• Use generous edge radii and polished contact pads to prevent micro-chipping and scratches
• Keep fork symmetry and throat width consistent to maintain uniform support; add ribs where stiffness is required
• Provide mounting pattern or handle geometry compatible with your tools/robots
• Add relief features to avoid contact with backside films, bumps, or fiducials
• We can advise practical tolerances for flatness, parallelism, and deflection based on size and geometry

Inspection & Testing

• Dimensional verification: overall size, fork opening, thickness, mounting pattern
• Flatness/parallelism checks on contact surfaces
• 100% visual inspection for chips, micro-cracks, and contamination; optional birefringence/stress check
• Cleanliness verification report by request

Applications

Manual and robotic wafer loading/unloading, metrology and inspection, cleaning and wet-bench transfer, carrier/FOUP/SMIF operations, precision handling of fragile glass/ceramic components

Packaging & Storage

Contact-surface protectors and separators; anti-static, vacuum-sealed packaging with rigid outer protection. Store dry (<40% RH) at 10–30 °C and away from HF-containing chemicals.

Quick Inquiry

If you want to know more about quartz glass or seek quartz glass solutions, contact us for professional services!

Available 24/7 via email or phone to help you with purchasing our quartz glass products, solutions, usage issues, or providing technical support.

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